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technical note system power supply lsi series for use in automotive electronics dmos system power supply ics with low current consumption BD4912/BD4912-v4 z description the BD4912/BD4912-v4 provides multiple supply voltage outputs for use in car audio and satellite navigation systems with cd player, radio, antenna, lighting, and other components. in addition to overcurrent, overvoltage, and thermal shutdown circuits, it incorporates circuitry for reacting to sudden battery power failures and is ideal for car audio and satellite navigation systems. with its 110 a (max.) standby current, the BD4912/BD4912-v4 delivers low current consumption when the battery is off. z features 1) built-in power supplies for car audio and satellite navigation systems ? 5.0 v microcontroller power supply ? 8.12 v audio power supply ? 7.9 v radio power supply ? 10.3 v lighting power supply ? 1 v dd -linked high side switch ? 2 v cc -linked high side switches 2) compatible with 0.1 f output load ceramic capacitors. (note: sele ct the adequate capacitance values for each particular application) 3) the ability to operate v dd using the charge stored in a backup capacitor, prevents the ic from malfunctioning in the event of a sudden battery power failure. 4) output pins use low-dropout p-channel power mos fets 5) built-in overcurrent protection circuits 6) built-in overvoltage protection circuits 7) built-in thermal shutdown circuit 8) a 12-pin power package gives the ic large power dissipati on capabilities and is ideal for space-saving designs. z applications car audio and satellite navigation systems ver.b oct.2005 now available esd resistance www.datasheet.co.kr datasheet pdf - http://www..net/
2/16 z absolute maximum ratings (ta = 25c) parameter symbol limits unit supply voltage 1 v cc 1 36 v supply voltage 2 v cc 2 36 v sel1 supply voltage sel1 12 v sel2 supply voltage sel2 12 v power dissipation pd 3400 mw operating temperature rang e topr -40 to +85 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c peak supply voltage 1 v cc 1 peak 50 (*1) v peak supply voltage 2 v cc 2 peak 50 (*1) v *1 tr 1 ms; bias voltage is applied for less than 200 ms. fig.1 peak supply voltage waveform z recommended operating ranges (ta = 25c) parameter limits unit comment recommended supply voltage range1 10 to 18 v except v dd and ilm output recommended supply voltage range 2 11.5 to 18 v ilm output recommended supply voltage range 3 6.3 to 18 v v dd output z electrical characteristics (unless otherwise specified, ta = 25c; v cc 1 = v cc 2 = 14.4 v) limits parameter symbol min. typ. max. unit condition standby circuit current ist ? ? 110 a output voltage (v dd ) 1 v o 1 4.80 5.00 5.20 v i o = 300 ma, v cc 2 = 10 v to 18 v dropout voltage ? v o 1 ? 0.8 1.1 v i o = 300 ma, v cc 2-v o 1 peak output current i o 1 400 ? ? ma v o 1 4.8 v ripple rejection ratio r.r1 50 55 ? db f = 100 hz, vrr = -10 dbv, i o = 300 ma low vcc output voltage v o 1? 4.8 ? ? v v cc 2 = 5 v, i o = 10 ma output voltage (audio) 2 v o 2 7.8 8.12 8.3 v i o 2 = 200 ma, v cc 1 = 10 v to 18 v dropout voltage ? v o 2 ? 0.4 0.7 v i o 2 = 200 ma, v cc 1-v o 2 peak output current i o 2 200 ? ? ma v o 2 7.8 v ripple rejection ratio r.r2 45 55 ? db f = 100 hz, vrr = -10 dbv, i o = 200 ma ? this product is not designed for pr otection against radioactive rays. ? use peak output current less than limits min. values. tr 1 m 50 v 35 v 0 v max. 200 ms (voltage supply more than 35 v) www.datasheet.co.kr datasheet pdf - http://www..net/
3/16 z electrical characteristics (unless otherwise specified, ta = 25c; v cc 1= v cc 2 = 14.4 v) limits parameter symbol min. typ. max. unit condition (sel1 > 3.5 v) dropout voltage (p.con) 3 ? v o 3 ? 0.4 0.7 v i o 3 = 350 ma, v cc 1-v o 3 peak output current i o 3 350 ? ? ma v o 3 13.7 v (sel1 > 7.0 v) dropout voltage (p.ant) 4 ? v o 4 ? 0.4 0.7 v i o 4 = 300 ma, v cc 1-v o 4 peak output current i o 4 300 ? ? ma v o 4 13.7 v (sel2 > 3.5 v) output voltage (am) 5 v o 5 7.5 7.9 8.3 v i o 5 = 25 ma, v cc 1 = 10 v to 18 v dropout voltage ? v o 5 ? 0.4 0.7 v i o 5 = 25 ma, v cc 1-v o 5 peak output current i o 5 25 ? ? ma v o 5 7.5 v ripple rejection ratio r.r5 45 55 ? db f = 100 hz, vrr = -10 dbv, i o = 25 ma (sel2 > 2.0 v) dropout voltage (sw5v) ? v o 6 ? 0.15 0.3 v i o 6 30 ma, v dd -v o 6 peak output current i o 6 30 ? ? ma v o 6 v dd -0.2v (sel1 > 1.5 v) output voltage (ilm) 7 v o 7 9.9 10.3 10.7 v i o 7 = 200 ma, v cc 1 = 12 v to 18 v dropout voltage ? v o 7 ? 0.5 0.8 v i o 7 = 200 ma, v cc 1-v o 7 peak output current i o 7 200 ? ? ma v o 7 9.9 v ripple rejection ratio r.r7 40 50 ? db f = 100 hz, vrr = -10 dbv, i o = 200 ma input (sel1) standby level vth1-1 ? ? 1.0 v ilm on vth1-2 1.5 ? 3.0 v ilm, p-con on vth1-3 3.5 ? 5.0 v ilm, p-con, p-ant on vth1-4 7.0 ? 12.0 v sel1 input impedance rin1 100 ? ? k ? input (sel2) standby level vth2-1 ? ? 1.0 v audio, sw5v on vth2-2 2.0 ? 3.0 v audio, sw5v, am on vth2-3 3.5 ? v dd v sel2 input impedance rin2 100 ? ? k ? overvoltage protection threshold vovp 27 30 33 v ? this product is not designed for pr otection against radioactive rays. ? use peak output current less than limits min. values. www.datasheet.co.kr datasheet pdf - http://www..net/
4/16 z reference data (unless otherwise specified, v cc 1= v cc 2 = 14.4 v) 0 1 2 3 4 5 6 0 10203040 supply voltage:vcc1,2 [v] output voltage:vo1 [v] fig.2 standby circuit current 0 20 40 60 80 10 100 1000 10000 100000 frequency:f [hz] ripple rejection:rr1 [db] fig.3 vdd line regulation (i o = no load) fig.4 vdd load regulation fig.8 audio line regulation (i o = no load) fig.9 audio load regulation fig.10 audio dropout voltage (v cc 1 = v cc 2 = 7.8 v) fig.5 v dd dropout voltage (v cc 1 = v cc 2 = 4.8 v) fig.6 v dd ripple rejection ratio (i o = 300 ma) fig.7 v dd output voltage vs temperature 0 2 4 6 50 100 150 200 ambient temperature:ta [ ] vd d o utp ut v ol ta g e: vo 1 [ v] 0 0.2 0.4 0.6 0.8 0 100 200 300 400 output current:io [ma] vdd dropout voltage: vo1 [v] 4.8 4.9 5.0 5.1 5.2 -60 -20 20 60 100 ambient temperature:ta [ ] vdd output voltage:vo1 [v] 0 2 4 6 8 10 0 10203040 supply voltage:vcc1,2 [v] audio output voltage:vo2 [v] 0 2 4 6 8 10 0 100 200 300 400 500 output current:io [ma] audio output voltage:vo2 [v] 0 0.1 0.2 0.3 0.4 0.5 0 50 100 150 200 output current:io [ma] audio dropout voltage: vo2 [v] ta =85 ta =25 ta =-4 0 ta =85 ta =-4 0 ta =25 ta =85 ta =-4 0 ta =25 ta =-4 0 from the left, ta =85 ta =25 ta =-4 0 from the left, ta =85 ta =25 ta =-4 0 from the left, ta =85 ta =25 ta =-4 0 from the left, ta =85 ta =25 0 200 400 600 800 1000 010203040 supply voltage:vcc1,2 [v] stby circuit current:ist [ a] ta =-4 0 from the left, ta =85 ta =25 www.datasheet.co.kr datasheet pdf - http://www..net/
5/16 0 2 4 6 8 10 0 1020304050 output current:io [ma] am output voltage:vo5 [v] 0 2 4 6 8 10 010203040 supply voltage:vcc1,2 [v] am output voltage:vo5 [v] 0 0.1 0.2 0.3 0.4 0.5 0 100 200 300 output current:io [ma] p.ant dropout voltage:vo4 [v] fig.15 p.ant load regulation fig.17 am line regulation (i o = no load) fig.18 am load regulation fig.19 am dropout voltage (v cc 1 = v cc 2 = 7.5 v) fig.14 p.con dropout voltage fig.16 p.ant dropout voltage 0 5 10 15 0 200 400 600 800 output current:io [ma] p.ant output voltage:vo4[v ] 0 0.2 0.4 0.6 0 50 100 150 200 250 300 350 output current:io [ma] p.con dropout voltage: vo3 [v] 0 0.1 0.2 0.3 0.4 0.5 0 5 10 15 20 25 output current:io [ma] am dropout voltage: vo5 [v] fig.11 audio ripple rejection ratio (i o = 200 ma) fig.12 audio output voltage vs temperature fig.13 p.con load regulation 0 30 60 10 100 1000 10000 100000 frequency:f [hz] ripple rejection:rr2 [db] 7.9 8.0 8.1 8.2 8.3 -60 -20 20 60 100 ambient temperature:ta [ ] audio output voltage:vo2 [v] 0 5 10 15 0 200 400 600 output current:io [ma] p.con output vo ltage:vo3 [v] ta =-4 0 from the left, ta =85 ta =25 ta =25 from the left, ta =-4 0 ta =85 ta =25 from the left, ta =-4 0 ta =85 ta =-4 0 ta =25 ta =85 ta =-4 0 from the left, ta =85 ta =25 ta =85 ta =25 ta =-4 0 ta =25 from the left, ta =-4 0 ta =85 ta =85 ta =25 ta =-4 0 www.datasheet.co.kr datasheet pdf - http://www..net/
6/16 0 2 4 6 8 0 100 200 300 400 500 output current:io [ma] sw5v output voltage:vo6 [v] fig.20 am ripple rejection ratio (i o = 25 ma) fig.21 am output voltage vs temperature fig.22 sw5v load regulation fig.23 sw5v dropout voltage (v cc 1 = v cc 2 = 10 v) fig.24 ilm line regulation (i o = no load) fig.25 ilm load regulation fig.26 ilm dropout voltage (v cc 1 = v cc 2 = 9.9 v) fig.27 ilm ripple rejection ratio (i o = 200 ma) fig.28 ilm output voltage vs temperature 0 20 40 60 80 10 100 1000 10000 100000 frequency:f [hz] ripple rejection:rr5 [db] 7.7 7.8 7.9 8.0 8.1 -60 -20 20 60 100 ambient temperature:ta [ ] am output voltage:vo5 [v] 0.00 0.02 0.04 0.06 0.08 0.10 0102030 output current:io [ma] sw5v dropout voltage: vo6 [v] 0 2 4 6 8 10 12 010203040 supply voltage:vcc1,2 [v] ilm output voltage:vo7 [v] 0 2 4 6 8 10 12 0 50 100 150 200 250 300 350 output current:io [ma] ilm output voltage:vo7 [v] 0 0.2 0.4 0.6 0.8 0 50 100 150 200 output current:io [ma] ilm dropout voltage: vo7 [v] 0 20 40 60 80 10 100 1000 10000 100000 frequency:f [hz] ripple rejection:rr7 [db] ta =-4 0 from the left, ta =85 ta =25 ta =85 ta =25 ta =-4 0 ta =-4 0 from the left, ta =85 ta =25 ta =25 from the left, ta =-4 0 ta =85 ta =85 ta =25 ta =-4 0 ta =-4 0 from the left, ta =85 ta =25 10.1 10.2 10.3 10.4 10.5 -60 -40 -20 0 20 40 60 80 100 ambient temperature:ta [ ] ilm output voltage:vo7 [v] from the top top curve ta=85 middle curve ta=-40 lower curve ta=25 www.datasheet.co.kr datasheet pdf - http://www..net/
7/16 0 5 10 15 20 012345 sel1 voltage:v sel1 [v] p.cont output voltage:vo3 [v ] 0 2 4 6 8 10 012345 sel2 voltage:v sel2 [v] am output voltage:vo5 [v] 0 2 4 6 8 10 00.511.522.5 sel2 voltage:v sel2 [v] audio output voltage:vo2 [v] fig.29 ilm input threshold voltage fig.30 p.con input threshold voltage fig.31 p.ant input threshold voltage fig.32 audio input threshold voltage fig.33 am input threshold voltage fig.34 sel1 input current fig.35 sel2 input current fig.36 overvoltage operation fig.37 thermal shutdown operation 0 3 6 9 12 00.511.522.5 sel1 voltage:v sel1 [v] ilm output voltage:vo7 [v] 0 5 10 15 20 024681012 sel1 voltage:v sel1 [v] p.ant output voltage:vo4[v] 0 20 40 60 80 04812 sel1 voltage:v sel1 [v] sel1 current:i sel1 [ a] 0 20 40 60 80 04812 sel2 voltage:v sel2 [v] sel2 current:i sel2 [ a] 0 2 4 6 8 10 010203040 supply voltage:vcc1,2 [v] audio output voltage:vo2 [v] 0 2 4 6 50 100 150 200 ambient temperature:ta [ ] vd d output voltage: vo1 [ v] ta =25 ta =85 ta =-4 0 ta =25 ta =85 ta =-4 0 ta =25 ta =85 ta =-4 0 ta =25 ta =85 ta =-4 0 ta =25 ta =85 ta =-4 0 ta =85 ta =25 ta =-4 0 ta =85 ta =25 ta =-4 0 ta =-4 0 from the left, ta =85 ta =25 www.datasheet.co.kr datasheet pdf - http://www..net/
8/16 z block diagram fig.38 pin assignment diagram fig.39 block diagram z pin descriptions 1 gnd this pin is connect ed to the ic's substrate. 2 ilm this pin serves as the lighting power s upply (10.3 v; peak output current: 200 ma). 3 p.ant this pin outputs a voltage that is approx imately 0.4 v (typ) lower than the v cc 1 pin voltage, and the peak output current is 300 ma. 4 p.con this pin outputs a voltage that is approx imately 0.4 v (typ) lower than the v cc 1 pin voltage, and the peak output current is 350 ma. 5 am this pin serves as the am receiver power supply (7.9 v; peak output current: 25 ma). 6 v cc 1 this pin is connected to the car's backup and acc power supplies. 7 audio this pin serves as the common system power supply for volume and sound control (8.12 v, peak output current: 200 ma), as well as the power supply for variable capacitance diodes and other components used for electronic tuning and cassette player features, such as the equalizer. 8 sw5v this pin serves as the microcontroller power supply (5.0 v; peak output current: 30 ma). 9 v dd this pin serves as the microcontroller power supply (5.0 v; peak output current: 400 ma). 10 v cc 2 this pin serves as the v dd power supply pin. 11 sel1 ilm, p.con, and p.ant output c an be switched on or off by applying a 2.25 v, 4.25 v, or 9.5 v signal to this pin. 12 sel2 audio, sw5v, and am output c an be switched on or off by applying a 2.5 v or 4.25 v signal to this pin. 0.47 f pre reg vref thermal shutdown 4 state v f 3 state except vdd, sw5v off vcc1 sel1 sel2 gnd vcc1 v dd vcc1 vcc1 vcc1 vcc1 vcc2 v dd ilm p. a n t am sw5v audio p. c o n over protection circuit all outputs off 10 9 2 4 3 5 8 7 6 11 12 1 0.47 f 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f 0.1 f o ver protection circuit gnd ilm p. a n t p.con 1 2 3 4 5 6 7 8 9 11 10 12 am v cc 1 audio sw5v v dd v cc 2 sel1 sel2 BD4912 BD4912-v4 www.datasheet.co.kr datasheet pdf - http://www..net/
9/16 z i/o equivalent circuit diagrams z timing chart fig.44 timing chart 1k 10k r2 r3 r1 vcc gnd pin 1k 1k gnd 1k 10k 122k 78k sel2(12pin) p. a n t ( 3 p in ) p. c o n 4pin 10k 100k 5k 0.29 vcc1 gnd 200k tsd on 1k 1k 10k 1k 1k 1k 122.7k 35.4k 41.9k gnd 1 11pin pin vcc r1[ ] r 2[k ] r3[k ] ilm 2pin vcc1 0.50 448.5 61.9 am 5pin vcc1 4.00 445.4 80.7 audio 7pin vcc1 0.43 437.7 78.5 v dd (9pin vcc2 0.25 381.3 125.0 v cc 1 v cc 2 v dd sel1 ilm p. c o m p. a n t sel2 audio sw5v am 3 pin (p.ant), 4 pin (p.con) 11 pin (sel1) 2, 5, 7, 9 pin (ilm, am, audio, v dd ) 12 pin (sel2) fig.40 fig.41 fig.43 fig.42 www.datasheet.co.kr datasheet pdf - http://www..net/
10/16 z application circuit (unit r: ? , c: f) fig.45 application circuits example batt gnd ilm p. a n t p.con am vcc1 audio sw5v v dd vcc2 sel1 sel2 cpu ign vdd sel2 sel1 am cs b/t main amp 0.1 sw5v ilm 0.1 0.1 0.1 0.1 0.1 0.1 auto ant BD4912 BD4912-v4 0.47 0.47 www.datasheet.co.kr datasheet pdf - http://www..net/
11/16 z thermal design fig.46 power dissipation characteristics refer to the heat reduction characteristics illustrated in fig. 46 when using the ic in an environment where ta 25c. the characteristics of the ic are greatly influenced by the operat ing temperature. if the temperatur e is in excess of the maximum junction temperature tjmax, the elements of the ic may be deteriorated or damaged. it is necessary to give sufficient consideration to the heat of the ic in view of two points; first, the protection of the ic from instantaneous damage and second , the maintenance of the reliability of the ic in long-time operation. in order to protect the ic from thermal destruction, it is nece ssary to operate the ic below the maximum junction temperature tjmax. the chip's (junction area) temperature tj may rise cons iderably even when the ic is being used at room temperature (25c). always operate the ic within the power dissipation pd. fig.47 the maximum power consumption p max (w) can be calculated as described below, where a denotes the maximum v cc 1 input voltage and b denotes the maximum v cc 2 input voltage: i 1 = max. v dd output current i 2 = max. audio output current i 3 = max. p.con output current i 4 = max. p.ant output current i 5 = max. am output current i 6 = max. sw5v output current i 7 = max. ilm output current ? power consumed by v dd p1 = (b-5.0 v) i 1 ? power consumed by audio p2 = (a-8.12 v) i 2 ? power consumed by p.con p3 = 0.7 v i 3 ? power consumed by p.ant p4 = 0.7 v i 4 ? power consumed by am p5 = (a-7.9 v) i 5 ? power consumed by sw5v p6 = 0.7 v i 6 ? power consumed by ilm p7 = (a-10.3 v) i 7 ? power consumed by each circuit's current p8 = a circuit current (circuit cu rrent is approximately 2 ma) p max = p 1 + p 2 + p 3 + p 4 + p 5 + p 6 + p 7 + p 8 0 power dissipation:pd w 25 50 75 100 125 150 10 20 30 40 50 37.5(1) 19.0(2) 8.0(3) 3.4(4) (1) when using an infinite heat sink j-c = 2.0 (c/w) (2) 100 100 2 (mm 3 ) (when using an aluminum heat sink) (3) 50 50 2 (mm 3 ) (when using an aluminum heat sink) (4) ic without heat sink operation. j-a = 36.8 (c /w) note: when using an aluminum heat sink, use a tightening torque of 6 (kg ? cm) and apply silicon grease. a mbient temperature:ta L load vcc vref www.datasheet.co.kr datasheet pdf - http://www..net/
12/16 z operation notes 1. absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximu m ratings, consider adding circuit protection devices, such as fuses. 2. gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 3. thermal design use a thermal design that allows for a sufficient margin in ligh t of the power dissipation (pd) in actual operating conditions. 4. inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pins are shorted together. 5. actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic field as doing so may cause the ic to malfunction. 6. testing on application boards when testing the ic on an application board, connecting a capacito r to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. 7. regarding input pin of the ic this monolithic ic contains p+ isolatio n and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. . fig.48 example of a simple monolithic ic architecture gnd p substrate n p n n p p (pin a) resistor gnd n p n n p p parasitic element parasitic elements p substrate parasitic element parasitic elements (pin b) c b e transistor (npn) gnd (pin a) (pin b) other adjacent element gnd c b e www.datasheet.co.kr datasheet pdf - http://www..net/
13/16 8. ground wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of application so that t he pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal gr ound voltage. be careful not to change the gnd wiring pattern of any external components, either. 9. recommended operating ranges the circuit functional operations are guaranteed within th e operating voltage range and o perating temperature range. although standard electrical characteristics values are not g uaranteed, characteristics values will not vary suddenly within these ranges. however, careful consideration must be taken in designing the circuit. 10. output capacitors capacitors used to eliminate oscillation must be placed between the v dd (pin 9), audio (pin 7), am (pin 5), ilm (pin 2), p.con (pin 4), p.ant (pin 3), and sw5v (pin 8) output pins and the gnd pin. connect a capacitance of at least 0.1 f. ceramic capacitors can be used. abrupt input voltage and load fluctuations can affect output voltages. output capacitor capacitance values s hould be determined after sufficient testing using the actual application. 11. applications or inspection processes with modes where the potentials of the v cc pin and other pins may be reversed from their normal states may cause damage to the ic's internal circuitry or elements. for example, such damage might occur when v cc is shorted with the gnd pin while an external capacitor is charged. use capacitors that fall within the range listed for each pin in table 1. it is recommended to insert a diode to prevent back current flow in series with v cc , or bypass diodes between v cc and each pin. if the v cc pin carries a lower voltage than the gnd pin, insert a protective diode between the v cc and gnd pins. output pin output capacitor v dd 0.1 f to 2200 f sw5v 0.1 f to 2200 f audio 0.1 f to 220 f am 0.1 f to 2200 f p.con 0.1 f to 10 f p.ant 0.1 f to 10 f ilm 0.1 f to 47 f table 1 fig.49 example of bypass diode insertion to prevent back current flow 12. overcurrent protection circuits the ic incorporates built-in overcu rrent protection circuits for the v dd (pin 9), audio (pin 7), am (pin 5), ilm (pin 2), p.con (pin 4), p.ant (pin 3), and sw5v (pin 8) output pins. each circuit is specifically designed for the current capacity of the corresponding pin and acts to prevent damage to the ic when an overcurrent flows. the protection circuits use dropping fold-back type current limiting and are designed to limit current flow by not latching up in the event of a large and instantaneous current flow, originating from a large capacitor or other component. their design allows for sufficient safety margins. these protection circuits are effectiv e in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications characterized by the continu ous operation or transitioning of the protection circuits (for example, applications where the ic is continuously connected to a load that si gnificantly exceeds the output current capacity). use caution regarding thermal design, as the output current capacity varies negatively with the temperature characteristics. 13. overvoltage protection circuit the overvoltage protection circuit is des igned to turn off all output other than v dd and sw5v output when the voltage differential between the v cc 1 (pin 6) and gnd (pin 1) pins exceeds approximately 30 v (at room temperature). v dd and sw5v output are turned off when the vo ltage differential between the v cc 2 (pin 10) and gnd (pin 1) pins exceeds approximately 30 v (at room temperature). v cc output pin diode for preventing back current flow bypass diode protective diode www.datasheet.co.kr datasheet pdf - http://www..net/
14/16 use caution when determining the supply voltage range to use. 14. thermal shutdown circuit (tsd circuit) the ic incorporates a built-in thermal shutdown circuit (tsd circuit). however, in the event that the ic continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's temperature tj will trigger the thermal shutdown circuit to turn off all output power elements. the ci rcuit will automatically reset once the chip's temperature tj drops. the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prev ent runaway thermal operation. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. 15. ground patterns pattern routes connecting the ground points, indicated in applic ation circuits example, to the gnd pin (pin 1) should be sufficiently short and should be positio ned to avoid electrical interference. 16. bypass capacitors between the v cc 1/v cc 2 and gnd pins it is recommended to insert a bypass capacitor from 0.47 f to 10 mf between the v cc 1/v cc 2 and gnd pins, positioning it as close as possible to the pins. 17. grounding the p.con and p.ant pins when the ic's gnd pin (pin 1) is open and the p.con (pin 4) and p.ant (pin 3) pins are connected to a negative battery terminal (are grounded), a parasitic element may occur inside t he ic, resulting in damage. to prevent such damage, it is recommended to insert a schottky diode between the p. con and p.ant pins and the gnd pin. (see fig. 50.) fig.50 ground prevention circuit diagram 18. applications with modes wher e the potentials of the input (v cc 1) and gnd pins and other output pins may be reversed from their normal states may cause damage to the ic's inter nal circuitry. in particular, it is recommended to create a bypass route with diodes or other components when loads including large inductance components are connected as with the p.ant and p.con pins in applications, where bemf may be generated during startup or when output is turned off. (example) fig.51 example of protective diode insertion 19. always verify the characteristics of example application circ uits prior to their use. when changing other external circuit constants, allow for sufficient margins after considering t he variability of both the rohm ic and external components, including both static and transient characteristics. output pin power supply vcc1 p. c o n p. a n t gnd www.datasheet.co.kr datasheet pdf - http://www..net/
15/16 z selecting a model name when ordering package noting: sip-m12(v4) rohm model name package noting: sip-m12 packaging specifications: noting: tube container b d 4 9 1 2 sip-m12 ( v4 ) (unit:mm) when you order , please order in times the amount of package quantity. containe r quantit y direction of feed tube 300 p cs direction of products is fixed in a container tube. when you order , please order in times the amount of package quantity. containe r quantit y direction of feed tube 300 p cs direction of products is fixed in a container tube. sip-m12 (unit:mm) 1.2 21.6 0.5 7.0 0.1 1.2 6.5 0.5 1 6.9 0.1 2.54 0.6 12 29.8 0.2 24.0 0.1 13.9 0.3 0.4 0.1 4.7 0.2 r1.8 packaging specifications: noting: tube container b d 4 9 1 2 v 4 rohm model name www.datasheet.co.kr datasheet pdf - http://www..net/
the contents described herein are correct as of october, 2005 the contents described herein are subject to change without notice. for updates of the latest information, please contact and confirm with rohm co.,ltd. any part of this application note must not be duplicated or copied without our permission. application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. p lease pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. any data, including, but not limited to application circuit diagrams and information, described herein are intended only a s illustrations of such devices and not as the specifications for such devices. rohm co.,ltd. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose o f the same, implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by rohm co., ltd. is granted to any such buyer. the products described herein utilize silicon as the main material. the products described herein are not designed to be x ray proof. published by application engineering group catalog no.05t385be '05.10 rohm c 1000 tsu www.datasheet.co.kr datasheet pdf - http://www..net/
notes no technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of rohm co.,ltd. the contents described herein are subject to change without notice. the specifications for the product described in this document are for reference only. upon actual use, therefore, please request that specifications to be separately delivered. application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. rohm co.,ltd. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by rohm co., ltd. is granted to any such buyer. products listed in this document are no antiradiation design. appendix1-rev2.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / europe / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2008 rohm co.,ltd. the products listed in this document are designed to be used with ordinary electronic equipment or de vices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. it is our top priority to supply products with the utmost quality and reliability. however, there is always a chance of failure due to unexpected factors. therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. rohm cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the notes specified in this catalog. 21 saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix www.datasheet.co.kr datasheet pdf - http://www..net/

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